中国发明专利：一种浅色透明耐高温形状记忆聚酰亚胺薄膜材料及其制备方法

发明（设计）人：韦嘉，俞燕蕾，兰中旭

申请人：复旦大学

专利号：ZL 201910038132.6

摘要：

本发明提供了一种浅色透明耐高温形状记忆聚酰亚胺薄膜材料及其制备方法，该类聚酰亚胺薄膜材料不仅具有优异的耐高温形状记忆性能（320℃<Tg<380℃），同时在可见光范围内具有良好的透光率，而且颜色较浅（截止波长处于310 nm~336 nm），有望实现在柔性光电器件基板材料及高温形状记忆材料领域的应用。其制备过程为：在氮气保护下，将含有三氟甲基结构的二胺单体、二酐单体及带有氨基基团的笼型聚倍半硅氧烷以一定比例溶解于有机溶剂中，降温至‑10℃~0℃，搅拌一段时间后得到聚酰胺酸前驱体溶液，再将该前驱体溶液在玻璃基板上涂膜，经过热亚胺化，最终得到浅色透明耐高温形状记忆聚酰亚胺薄膜。

Abstract：

The invention provides a light-color transparent and high-temperature-resistant shape memory polyimide film material and a preparation method thereof. The polyimide film material not only has excellent high-temperature-resistant shape memory performance (320 DEG C<Tg<380 DEG C), but also has good light transmittance in the visible light range, and the color is light (cutoff wavelength is at 310 nm~ 336 nm), which is expected to be applied in the field of flexible optoelectronic device substrate materials and high-temperature shape memory materials. The preparation method includes: dissolving diamine monomers containing a trifluoromethyl structure, dianhydride monomers and polyhedral oligomeric silsesquioxane with amino groups into an organic solvent under nitrogen protection according to a certain proportion, cooling to minus 10 DEG C to 0 DEG C, stirring for a certain time period to obtain a polyamide acid precursor solution, coating a glass substrate with the polyamide acid precursor solution, and performing thermal imidization to obtain the light-color transparent and high-temperature-resistant shape memory polyimide film.