Chinese invention patent: Light-color, transparent and high-temperature-resistant shape memory polyimide film material and preparation method thereof

Inventor: Jia Wei, Yanlei Yu, Zhongxu Lan

Applicant: Fudan University

Patent No.: ZL 201910038132.6

Abstract：

The invention provides a light-color transparent and high-temperature-resistant shape memory polyimide film material and a preparation method thereof. The polyimide film material not only has excellent high-temperature-resistant shape memory performance (320 DEG C<Tg<380 DEG C), but also has good light transmittance in the visible light range, and the color is light (cutoff wavelength is at 310 nm~ 336 nm), which is expected to be applied in the field of flexible optoelectronic device substrate materials and high-temperature shape memory materials. The preparation method includes: dissolving diamine monomers containing a trifluoromethyl structure, dianhydride monomers and polyhedral oligomeric silsesquioxane with amino groups into an organic solvent under nitrogen protection according to a certain proportion, cooling to minus 10 DEG C to 0 DEG C, stirring for a certain time period to obtain a polyamide acid precursor solution, coating a glass substrate with the polyamide acid precursor solution, and performing thermal imidization to obtain the light-color transparent and high-temperature-resistant shape memory polyimide film.